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Regular version of the site
2024/2025

Materials for Microelectronics: Technologies and Diagnostics

Type: Mago-Lego
Delivered by: Faculty of Chemistry
When: 1, 2 module
Open to: students of one campus
Language: English
ECTS credits: 6
Contact hours: 76

Course Syllabus

Abstract

Thin film devices represent to-date most developed and comprehensive technological processes and serve the applications driving global economy. The manufacturing includes a variety of deposition techniques, patterning and etching, inline analytics, and other actions. Such devices are used in electronics, photonics, catalysis, energy storage and harvesting at least. Besides high-end engineering, a crucial part of this research and development is in material science and modern analytics. The course in question gives therefore a broad overview of materials, analytics, and technologies of thin film devices. The materials are comprised of semiconductors, superconductors, ferroelectric and thermoelectric ones mostly. They cover such classes of solids as oxides, chalcogenides, hybrid halides, coordination compounds, carbon- and silicon-based materials, organic polymers. To better understand how defects and free charge carriers form, some insights into solid-state chemistry is given. The course considers modern analytics divided in four parts: determination of composition (e.g. EDX, EPMA, XPS, GDOES etc.); characterization of structure (e.g. XRD, EBSD, Raman spectroscopy, AFM, SEM etc.); disclosure of electronic structure (UPS, IPES, Auger spectroscopy, EXAFS/XANES, SPV, KP/PYS); characterization of the functional properties (i.e. electrical, optical, magnetic ones, PL, TRPL, IV, CV etc.). The third part gives an overview of thin film devices (e.g. solar cells, photodiodes, transistors, information storage, detectors, displays, batteries, etc.) explaining principles of their functioning. A general information on manufacturing is given, considering such processes as film deposition (sputtering, CVD, ALD, wet-chemical ones), doping, patterning (masking, lithography, etching, imprinting) and encapsulation. Finally, the diagnostics of various devices in a sense of their performance is reviewed.